Process for curing polyimide layers

摘要

The invention relates to a process for the rapid and complete curing of polyimide layers, which are used, in particular, as radiation-protection covering for very highly integrated electronic memory components. The substrates (11) are subjected to microwave radiation at various temperatures in a microwave oven (1) having a plurality of chambers (21 to 24). The cured layers have at least equivalent quality with respect to mechanical and thermal properties as conventionally (thermally) cured polyimide layers. The layers remain smooth and bubble-free. Even electrostatically sensitive electronic components are not damaged by the microwave treatment. Compared with conventional processes, there is a time saving by a factor of from 10 to 20.