METHOD OF AND APPARATUS FOR FORMING THICK-FILM CIRCUIT

摘要

PCT No. PCT/JP84/00380 Sec. 371 Date Mar. 10, 1986 Sec. 102(e) Date Mar. 10, 1986 PCT Filed Jul. 26, 1984 PCT Pub. No. WO86/01067 PCT Pub. Date Feb. 13, 1986.The present invention relates to method and apparatus for forming a thick film circuit by discharging a thick film paste from a paste discharging hole of a drawing nozzle and drawing a desired pattern on a substrate. The paste discharging hole has a substantially wide configuration and the drawing nozzle is rotated about its axis of rotation so that the longitudinal direction of the elongated cross-section of the paste discharging hole is substantially normal to the direction in which the drawing nozzle is moved with respect to the substrate.