发明名称 Front stage process of a fully depleted silicon-on-insulator device and a structure thereof
摘要 The front-stage process of a fully depleted SOI device and the structure thereof are described An SOI substrate having an insulation layer and a crystalline silicon layer above the insulation layer is provided. An isolation layer is formed in the crystalline silicon layer and is connected to the insulation layer to define a first-type MOS active region. An epitaxial suppressing layer is formed above the crystalline silicon layer outside of the first-type MOS active region A second-type doped epitaxial silicon layer is selectively formed above the crystalline silicon layer in the first-type MOS active region. The second-type doped epitaxial layer is doped in-situ. An undoped epitaxial silicon layer is selectively formed above the second-type doped epitaxial silicon layer. The epitaxial suppressing layer is then removed.
申请公布号 US2002110988(A1) 申请公布日期 2002.08.15
申请号 US20020119975 申请日期 2002.04.09
申请人 YEH WEN-KUAN;TSENG HUA-CHOU;LIU JIANN 发明人 YEH WEN-KUAN;TSENG HUA-CHOU;LIU JIANN
分类号 H01L21/84;H01L27/12;(IPC1-7):H01L21/331 主分类号 H01L21/84
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