| 摘要 |
PURPOSE: An epoxy thermosetting resin composition is provided, to enable it to be cured in a short time at a temperature above 140 deg.C and to improve the heat impact resistance and the crack resistance of the cured one. CONSTITUTION: The epoxy thermosetting resin composition comprises 100 parts by weight of an epoxy mixture of a diglycidyl phthalate-based epoxy and a bisphenol epoxy containing at least two epoxy groups with an epoxy equivalence of 125-250 inside a molecule; 7-35 parts by weight of a half ester carbonic acid modified compound; 45-73 parts by weight of a polycarbonic acid anhydride; and 220-400 parts by weight of a filler, wherein The content of the half ester carbonic acid modified compound and the polycarbonic acid anhydride does not exceed 80 parts by weight. Preferably the filler is a crystalline silica, a fused silica or their mixture.
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