| 摘要 |
PURPOSE:To cut down the inspection manhours of wafers by a method wherein a probe conductivity testing conductor layers connecting to bonding pads in a chip region is provided at least in one chip region in a semiconductor wafer. CONSTITUTION:Semiconductor elements are formed in multiple chip regions 2 and conductivity testing chip regions 3 on a wafer 1. First, an aluminum film 4 is formed to form bonding pads 6 and the exposure map of an exposure device is previously set up in the conductivity testing chip regions 3 not to be exposed. In such an operation, the aluminum film 4 is formed on overall surface of the conductivity testing chip regions 3. Second, a protective film 5 is formed on the aluminum film 4 excluding the bonding pads 6. Through these procedures, the conductivity testing chip regions 3 with bonding pad connecting conductor layer can be formed on a sheet of wafer so that, in order to test the wafer, the inspection of contact and conduction state of a tester with the wafer may be performed using the conductivity testing chip regions 3.
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