| 摘要 |
PURPOSE:To contrive the improvement of the humidity resistance and the reliability of a semiconductor package by a method wherein a glass plate is made to cover in the aperture of a premolded package and at the same time, the peripheral part of the glass plate and the upper end surface of the package are coated with a flexible bonding agent layer and a potting resin is poured and cured. CONSTITUTION:A premolded package 1 consists of a thermoplastic resin case body 4 with a die pad 2 formed for mounting a semiconductor light-receiving element in its interior and metallic lead frames 3 made to protrude from its side surfaces. A potting resin pouring hole 5 and an air vent hole 6 are formed on the side surface of this package 1. Moreover, a covering film 7, for example, is formed in such a way that a bonding agent layer 9 and a releasing paper are laminated on a base film 8, then the 3 layers are all punched in the size of a CCD element, this releasing paper is removed and a glass plate 10 is temporarily bonded. This plate 10 is formed in a size smallish slightly than the aperture of the package 1 and the layer 9 is temporarily bonded on the peripheral part of the plate 10 and at the same time, is formed in such a form and a size that it is adhered on the upper end surface of the package 1.
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