| 摘要 |
PURPOSE:To manufacture elements with high assembling precision while improving the assembling yield by a method wherein any excessive solder is sucked up to be removed using a vacuum solder sucking tube. CONSTITUTION:Any excessively bonded solder 7 is sucked up thinly and evenly by a vacuum solder sucking tube 9. Then, the solder sucked up by the vacuum solder sucking tube 9 adheres to a net 10 fixed to the inner wall of the tube 9. The net 10 is made removable to prevent the tube 8 from being stuffed with the adhered solder. Next, a chip fixed to a chip sucking tube 5 is bonded onto the thinly and evenly spread solder 7. At this time, a vacuum pump 11 installed in a bonding device main body 13 may be connected to the vacuum solder sucking tube 9 from a vacuum pipe. Furthermore, the solder 7 is spread on a submount 4 using a pair of tweezers in the bonding process, however, an automatic solder spreader may be installed in the bonding device main body 13. |
