| 发明名称 |
METHOD FOR BONDING INTEGRATED CIRCUIT CHIPS |
| 摘要 |
<p>A method for rapidly bonding an integrated circuit chip (1) to a mating surface of a high surface energy substrate (5) using an adhesive pad (3) made from a substantially amorphous, solvent-free thermoplastic polymer.</p> |
| 申请公布号 |
EP0285051(A3) |
申请公布日期 |
1989.05.10 |
| 申请号 |
EP19880104940 |
申请日期 |
1988.03.26 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
GRAHAM, WILLIAM FRANK;LOFURNO, MEL AUGUSTINE;SAKIADIS, BYRON CHRISTOS |
| 分类号 |
C09J5/00;H01L21/52;H01L21/60;H01L23/495;H05K1/03;H05K3/30;(IPC1-7):H01L21/58 |
主分类号 |
C09J5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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