发明名称
摘要 PROBLEM TO BE SOLVED: To avoid having a rough surface to a product when a plurality of sets of metal-foil-clad laminated boards, each having an inner layer circuit built therein are hot pressed and molded and even when a metal mirror plate having a thickness of 0.8 mm or less is used to be disposed between the sets. SOLUTION: A prepreg and a metal foil are arranged on both sides of a core substrate from its inside in this order to form a laminated structure 1. A plurality of sets of such laminated structures 1 are placed between press hot platens with a metal mirror plate 2, having a thickness of 0.8 mm or less disposed therebetween, the resulting laminate is hot pressed at a pressure as low as 10 kgf/cm2 or less, until the viscosity of resin contained in the prepreg is reduced through heating and melting and reaches a level of 5×104 poise, at which time the pressure is increased to a predetermined level and the hot pressing is continued.
申请公布号 JP3405237(B2) 申请公布日期 2003.05.12
申请号 JP19980345777 申请日期 1998.12.04
申请人 发明人
分类号 H05K3/46;B29C43/18;B29C43/32;B30B7/02;B30B15/34;B32B15/08;(IPC1-7):H05K3/46 主分类号 H05K3/46
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