| 摘要 |
<p>PURPOSE:To remarkably utilize the wall surface of a clean room, making the width of wall surface of a clean room occupied by one heat-treating furnace less than or equal to a value wherein the width of one equipment is divided by the number of heat-treating furnaces. CONSTITUTION:A semiconductor wafer 6 in a cassette carrier 7 on a working stand 5 is transferred on a wafer board 8, by the operating of one transferring equipment 9a. The wafer boat 8 is carried under a necessary heat-treating furnace 11, by the operating of a first conveyer and a second conveyer of a conveying equipment, and then inserted in the heat treating furnace 11, by the operating of an elevator. The wafer 6 processed in the furnace 11 is taken out from the furnace 11 together with the boat 8, by operating of the elevator, and put in the carrier 7 on the working stand 5. As a result, the width of wall surface of a clean room occupied by one furnace 11 becomes less than or equal to a value wherein the width of one equipment is divided by the number of furnaces 11. Thereby remarkably utilizing the wall surface of a clean room.</p> |
