| 摘要 |
PURPOSE:To conduct the stage exchange of a backup pin for correcting the warpage of a substrate automatically by installing a backup pin implanting device within the operating range of a substrate positioning table and implanting and removing the backup pin. CONSTITUTION:A substrate positioning table 1 is moved within a table operating range 2 in order to perform work such as the application of adhesives, the mounting of an electronic part, etc., and a printed board not shown is positioned at a specified position. When work such as the mounting of the electronic part is completed regarding a fixed number of said printed boards and stage exchange for conducting the work of the next object substrate is performed, a backup pin 4 is stage-exchanged by automatically backup pin implanting devices 3a, 3b. Accordingly, the title mechanism is operated so that backup pins not required for the next object substrate in the backup pins for said object substrate are removed and backup pins necessary for the next object substrate are implanted. |
