| 摘要 |
PURPOSE:To alleviate thermal stress applied to solder balls and to allow an amount of heat generated by an integrated circuit element to be conducted to a sealing cap with high efficiency, by joining the rear face of the integrated circuit element to the inner face of the sealing cap with their joined faces being divided closely by a bonding material having high heat conductivity. CONSTITUTION:An integrated circuit element 1 is packaged on an electrical circuit board 2 by means of solder balls 3. A sealing cap 4 is provided so as to cover the element 1, while the rear face of the element 1 and the inner face of the cap 4 are joined to each other while they are divided closely by means of a bonding material having high heat conductivity 7. Any thermal stress generated by difference in coefficient of thermal expansion of various material for example among the cap 4, substrate 2 and the element 1 is not directly applied to the balls 3 but alleviated by the bonding layer 7. Accordingly, an amount of heat generated by the element 1 can be conducted to the cap 4 very efficiently.
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