发明名称 METHOD FOR MANUFACTURING FLEXIBLE PCB(PRINTED CIRCUIT BOARD) AND FLEXIBLE PCB MANUFACTURED BY THE METHOD, PARTICULARLY CONCERNED WITH IMPROVING FLEXIBILITY OF THE PRINTED CIRCUIT BOARD
摘要 PURPOSE: A method for manufacturing a flexible printed circuit board is provided to improve flexibility of the printed circuit board by not forming a plated layer on the rest portions except a region where a via hole is formed. CONSTITUTION: A laminated structure(20) is formed by laminating a copper film(12) on a base film(10). A circuit and a via hole(30) are formed on the copper film. A film member(40) is laminated on one side of a surface of the laminated structure. An electroless copper plating(50) is performed on the surface of the laminated structure. An electrolyte plating(60) is performed on the laminated structure. The film member is removed from the laminated structure. An upper film(70) is laminated on the laminated structure and the electrolyte plating.
申请公布号 KR20050017210(A) 申请公布日期 2005.02.22
申请号 KR20030055425 申请日期 2003.08.11
申请人 PANTECH CO., LTD. 发明人 LEE, DONG WOO
分类号 H05K3/42;(IPC1-7):H05K3/42 主分类号 H05K3/42
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