| 摘要 |
PURPOSE:To prevent the generation of the cracking of a ceramic package by using a copper-tungsten alloy having a thermal expansion coefficient approximating to that of the package for a stage, on which a semiconductor chip is loaded. CONSTITUTION:A copper tungsten CuW alloy having a thermal expansion coefficient approximating to that of a ceramic package 3 is employed for a stage 7 on which a semiconductor chip 1 is loaded. When 10% Cu and 90% W or 15% Cu and 85% W are used as the material of the copper-tungsten alloy, the thermal expansion coefficients of the alloys are brought respectively to 6.0(6.5)X10<-6>/ deg.C, and approximate to the thermal expansion coefficient of 6.7X10<-6>/ deg.C of alumina. Accordingly, the generation of cracking between the ceramic package and the stage can be prevented.
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