| 摘要 |
<p>A structure for edge mounting chip modules to planar boards is provided. The structure includes a pair (16, 18) of spaced side rails mounted on a support structure (14) extending generally parallel to each other. The rails each have first (22) and second (24) strips, insulated from each other, the strips each having projections (26, 28) extending therefrom and defining slots therebetween to receive the edges of the chip modules (10). Each strip is provided with an independent power level, whereby four distinct power levels can be suppled to the chip modules.</p> |
