| 摘要 |
In a process for manufacturing monocrystalline semiconductor plates, e.g. wafers, the melt (12) to be crystallized is introduced into a moulding shaft (14) connected to the bottom of the melting crucible (10). The moulding shaft has a smooth-walled inner surface machined to a high-quality optical finish and an inner width equal to the thickness of the semiconductor plates to be manufactured. As the monocrystal grows in the moulding shaft (14), it is pushed downward. When it reaches a sufficient length, the monocrystal can be severed perpendicular to the direction of feed at a distance from the length of an outer edge of the semiconductor plates to be manufactured.
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