| 摘要 |
A hermetically sealable package for electronic component comprising a metallic base member and a metallic lid member, in which the metallic base member has lead wires penetrating therethrough under insulation. The base member or lid member is provided on its periphery with a protrusion for welding. The protrusion can be terraced. The sealing can be made by an independently prepared sealing member to be inserted between the sealing area of the base member and the sealing area of the lid member. The protrusion or the sealing member can be prepared by an etching technology. |
