| 摘要 |
PURPOSE:To reduce the area of a semiconductor chip, and to facilitate the assembly of resistance values by composing part of one resistor of a component for forming a semiconductor device by a bonding wiring having a predetermined resistance. CONSTITUTION:A resistor R2 of resistors R1, R2 as components is formed of a polysilicon resistor 2 deposited on a silicon chip 5, and the resistor R1 is composed of a bonding wiring 1 having a resistance. Thus, the area of a chip can be reduced, and the assembly of the resistance values is facilitated. |
