发明名称 |
Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide |
摘要 |
Storage-stable heat-curable mixtures are described which contain (A) a polyimide which contains in the molecule at least two radicals of formula I <IMAGE> (I) wherein D is a divalent radical with a C=C double bond, (B) an alkenylphenol, (C) an epoxide group-free adduct of an epoxy resin with excess alkenylphenol or (D) a polyimide which is soluble in organic solvents or a mixture of (C) and (D). These mixtures are employed for example as laminating resins or electro-resins, as adhesives or adhesive films for application at high temperatures, or for the preparation of coatings.
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申请公布号 |
US4826927(A) |
申请公布日期 |
1989.05.02 |
申请号 |
US19870000255 |
申请日期 |
1987.01.02 |
申请人 |
CIBA-GEIGY CORPORATION |
发明人 |
SCHMID, ROLF;STAUFFER, WERNER;ZAHIR, ABDUL-CADER |
分类号 |
C08F2/44;C08F12/00;C08F20/52;C08F212/14;C08F222/40;C08F299/02;C08G65/00;C08G67/00;C08G73/12;C08L63/00;C08L71/08;C08L71/10;C08L79/04;C08L79/08;C09D179/08;(IPC1-7):C08G73/12 |
主分类号 |
C08F2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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