| 摘要 |
PURPOSE:To prevent generation of cracks caused by heat cycle, and moisture absorption and heating, by insulating electrically semiconductor elements and lead frames using sealing resin in the center of the bottom surface of a semiconductor element of a package. CONSTITUTION:Tape-like electrical insulators 7a and 7b are provided between the bottom surface of both electrodes 6 of a semiconductor element 1 in the center of a package, and a lead frame 4. Sealing resin 5 is applied to the space surrounded by a semiconductor element 1, the lead frame 4 and tape-like electrical insulators 7a and 7b. This permits electrical insulation for the semiconductor element 1 and the lead frame 4. This structure enables generation of cracks caused by heat cycle, and moisture absorption and heating to be prevented even when the semiconductor element 1 built in is made large. |
