| 发明名称 |
Heat dissipating interconnect tape for use in tape automated bonding |
| 摘要 |
The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.
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| 申请公布号 |
US4827376(A) |
申请公布日期 |
1989.05.02 |
| 申请号 |
US19870134740 |
申请日期 |
1987.12.18 |
| 申请人 |
OLIN CORPORATION |
发明人 |
VOSS, SCOTT V. |
| 分类号 |
H05K7/20;H01L21/60;H01L23/42;H01L23/433;H01L23/495;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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