| 摘要 |
A compact and dense hybrid integrated circuit device which can be encapsulated by transfer molding can be manufactured by forming through holes in a ceramic or glass substrate, which through holes have a diameter of less than 0.2 mm, preferably less than 0.1 mm, a thin film circuit element being formed on one surface of the substrate, and a thin or thick film circuit element being formed on the other surface of the substrate. A fine through hole as mentioned above can be formed by laser drilling, etc., and plating.
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