发明名称 HYBRIDIZED PRINTED CIRCUIT BOARD
摘要 PURPOSE:To install with high density by forming the width of a printed circuit board nearly the same as the maximum width of electronic components and providing leads at positions separated from installation positions of the electronic components of the printed circuit board. CONSTITUTION:Multiple electronic components 12... such as flat type packages are installed at preset positions on a rectangular printed circuit board, an electronic component 12 with the maximum width is installed nearly at the center. Many leads 13... are provided in the direction perpendicular to the preset side from positions other than this component 12. The board width Hl is contained in nearly the same width as the component width Hb without affected by the lead length Ha, where Hl is the width (board width) in the direction perpendicular to the preset side provided with the leads 13 of the printed circuit board 11, Hb is the component width of the electronic component 12 with the maximum width in this direction, and Ha is the lead length at the portion where the leads 13 are fixed to the printed circuit board 11.
申请公布号 JPH01112681(A) 申请公布日期 1989.05.01
申请号 JP19880020621 申请日期 1988.01.30
申请人 TOSHIBA CORP 发明人 ARINO TATEO
分类号 H05K1/18;H01L25/16;H05K1/11;H05K1/14;H05K3/34;H05K3/36;H05K5/00 主分类号 H05K1/18
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