IC PACKAGING CIRCUIT BOARD,申请号JP19870271137-传众专利搜索

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发明名称	IC PACKAGING CIRCUIT BOARD
摘要
申请公布号	JPH01112743(A)	申请公布日期	1989.05.01
申请号	JP19870271137	申请日期	1987.10.27
申请人	MATSUSHITA ELECTRIC WORKS LTD	发明人	TAKAMI SHIGENARI;IRIE TATSUHIKO;HASHIZUME JIRO
分类号	H01L21/60;H05K3/30;H05K3/40	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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