发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To stably produce the shape of a ship with good reproducibility by a method wherein grooves are formed with a scribing line on an array between, and load is applied by pressing an acute-edged tool against the array from below or the reverse side of the scribing line. CONSTITUTION:Grooves 4 are formed with a scribing line 3 on a semiconductor crystal array, on which electrodes 2 are formed after the completion of epitaxial growth, between. After that, the chip formation is done through the application of load by pressing an acute-edged tool 5 against the array from below or the reverse side of the scribing line 3. Due to the action of the grooves on both sides of the scribing line, the crystal surface, which is cloven by applying loaf with the acute-edged tool to the surface of the array on the reverse side of the surface having the scribing line thereon, is kept within the range between the grooves on both sides of the scribing line or does not come outside said range between the grooves during ship formation, even when there are damages, which run in various directions, just below the scribing line. Further, even when the damages extend further during ship formation, the damages gather to positions, which end to the bottoms of the grooves.
申请公布号 JPH01113209(A) 申请公布日期 1989.05.01
申请号 JP19870271310 申请日期 1987.10.27
申请人 FUJITSU LTD 发明人 KANEKO TOSHIAKI;ISHIYAMA TAKEO
分类号 B28D5/00;H01L21/301;H01L33/30;H01S5/02 主分类号 B28D5/00
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