| 摘要 |
PURPOSE:To lower a heat resistance and easily control pellet temperature by providing a wiring pattern for applying external voltage for ageing test comprising a diode and a resistance to a semiconductor wafers. CONSTITUTION:A voltage application wiring pattern 3 is provided at an electrode pad 2 of pellet 1 in the wafers. An external voltage application pad 4 is extended up to the end of wafers and a voltage is applied thereto. A diode 5 and a resistance 6 are inserted in series to the wiring part extended from the pad. In case of executing an electrical test of a pellet, a diode 5 is connected backward and therefore it does not receive influence of other pellets. In case of executing the ageing test, when an external voltage is applied, a diode is connected forward and thereby a current can be supplied to all pellets. Even if there is a faulty pellet where power supply and the ground are short-circuitted, a voltage is applied to a resistance and therefore a normal voltage is applied good pellets. |
