| 摘要 |
PURPOSE:To obtain a flat multilayer wiring by repeatedly constituting a wiring, a connecting column and a wiring. CONSTITUTION:An insulating film 3 is formed onto an insulating film 1. An organic film 6 is coated and changed into a pattern, and the film 3 is removed selectively while using the film 6 as a protective film. A gold film is evaporated onto the whole surface, and the wiring 2 is formed by utilizing the stepped difference of the film 6 and the film 3. The film 6 is removed, and an insulating film 7 is formed. An organic film 8 is coated and changed into a pattern, and the film 7 is removed selectively while using the film 8 as a protective film, thus forming a through-hole 4 at a specific position on the wiring 2. A metallic film is evaporated onto the whole surface in the same manner as the wiring 2 is formed, and the film 8 is removed, thus forming the connecting column 9. A metallic film is coated and changed into a pattern, thus forming the wiring 5. Accordingly, a stepped difference is not formed because the height of the wirings, the connecting column and their peripheral insulating films are approximately equal to each other, and there is no possibility of the disconnection of the upper layer wiring. |
