| 摘要 |
PURPOSE:To improve throughput, etching resistance characteristic and operability of a resist curing device by controlling a 2-tray type resist curing device in a distributed manner by a central main microcomputer and microcomputer logics of respective steps. CONSTITUTION:Microcomputer control substrates 2, 3, 4, 5 or a sequencer 13 for performing an ultraviolet radiation control, an induction heating temperature control, a hot plate and cool plate control, a wafer loader control, a wafer unloader control, a bypass belt control, etc., are provided, to be controlled in the respective steps in a distributed manner, and a main microcomputer 1 for totally control the whole is provided to totally control and monitor-display the operations thereof. Accordingly, a waiting time of an efficient UV radiation, quick heating by induction heating and accurate temperature control, a 2-tray type can be reduced. Thus, throughput, dry etching resistance characteristic and operability can be improved. |
