| 摘要 |
<p>PURPOSE:To achieve a low cost without being damaged by a dry etching operation by a method wherein a transparent etching-proof film is formed on the main surface of a glass substrate and a light-shielding film pattern is formed on it. CONSTITUTION:A transparent silicon oxide film 2 of a uniform thickness is formed on the whole main surface of a glass substrate 1; a light-shielding film 3 is formed on its whole surface; a positive resist film 4 is coated on its whole surface. Then, a device pattern of an object to be inspected is reduction- projected on the positive resist film 4 by using a reticle of the object to be inspected, and is exposed to light; the film is developed; a resist of an exposed part is removed; the substratum light-shielding film 3 is exposed; the light- shielding film 3 is dry-etched by making use of a remaining positive resist film 4A as a mask; a light-shielding film pattern 3A is formed. Accordingly, because the surface of the glass substrate 7 is not damaged directly by a dry- etching operation, the same glass substrate 1 can be reused many times only if the transparent film 2 is removed and is formed again. By this setup, a low cost is achieved.</p> |
