RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent a bonding wire from being stripped off due to a difference in thermal expansion between a semiconductor substrate and a resin block by a method wherein a protective film is formed on the surface of the semiconductor substrate and a resin film having two or more openings is formed between the substrate and the resin block. CONSTITUTION:A protective film 5 is formed on a semiconductor substrate chip 1 where a device and a wiring part have been formed; a polyimide film 10 is formed on the protective film 5. Two or more openings 11 are formed in the polyimide film 10; the surface of the protective film 5 is exposed inside the openings 11. Accordingly, because a resin block 2 is bonded to the protective film 5 inside the openings 11, expansion of the resin block 2 due to a rise in temperature is suppressed by the semiconductor substrate chip 1; a whole part of the expansion in a transverse direction of the resin block 2 as caused in a conventional structure is not concentrated on a part of a contact hole 6. By this setup, a bonding wire 4 is pushed in the transverse direction; it is possible to prevent the bonding wire from being stripped off from a pad 7.