发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To extend the service life of a target by forming the target to a spherical, circular cylindrical or cylindrical shape and specifying the part to be sputtered. CONSTITUTION:For example, the spherical target 1, a magnet 2 and an earth shielding plate 3 are set as shown in the figure in a sputtering device provided with the target and substrate electrode. The diameter of the spherical target 1 is about 100mm. The target material is Co and the intra-surface component of the magnetic field at the top of the target is 50Oe. The earth shielding plate 3 exists in the position where the ball is bisected. About -500V DC voltage is impressed to the target 1. The pressure of gaseous Ar at the time of sputtering is set at about 5mTorr. A film is thereby deposited at about 12Angstrom /sec deposition speed on the glass substrate on the substrate electrode upper by about 50mm from the top of the ball. Part of the surface of the target is sputtered if the target is spherical. Part of the side faces is sputtered if the target is circular cylindrical or cylindrical. The target is rotated around the ball in the case of the spherical target and is rotated around the axis in the case of the circular cylindrical or other shapes, thereby extending the life thereof.
申请公布号 JPH01111873(A) 申请公布日期 1989.04.28
申请号 JP19870269178 申请日期 1987.10.27
申请人 HITACHI MAXELL LTD 发明人 OSHIMA KIYOTAKA;FUJIWARA HIDEO
分类号 C23C14/34 主分类号 C23C14/34
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