| 摘要 |
PURPOSE:To increase a packaging density and to obtain a semiconductor device inhibiting signal transmission from being delayed by a method wherein the device is provided with an ECL type logical circuit having an input part and an output consisting of a bipolar transistor, a means for leading-in of an emitter- follower current for output in the input part and a means capable of selecting whether to actuate the means for leading-in of an emitter-follower current or not at the time of packaging. CONSTITUTION:An ECL type logical circuit 2 having an input part I and an output part consisting of a bipolar transistor To, a means for leading-in of an emitter-follower current for output in the input part I and a means capable of selecting whether to actuate the means for leading-in of an emitter-follower current or not at the time of packaging are provided. For example, input terminals IN1 and IN2 are respectively connected to a termination power terminal VT through current fuses F1 and F2 and termination resistors R1 and R2. In case one of the terminals IN1 and IN2 does not need a termination at the time of connection with other semiconductor device, the fuse F1 or F2 is fuse-cut by causing to flow an excessive current larger than the normal emitter-follower current between the terminal IN1 or IN2 and the terminal VT. |
