| 摘要 |
<p>PURPOSE:To increase adhesion by supplying a molding mold preheated at a fixed temperature or more with a copper foil, on one surface of which specific adhesives are coated, injecting a thermoplastic resin and simultaneously conducting the molding of a molded form and the adhesion of the copper foil onto the molded form. CONSTITUTION:Polycarbonate, polyether sulfone or polyether imide is used as a base material resin, and polyvinylbutyral or polyvinylformal is employed as the adhesives of a copper foil and the base material resin. The mixed liquid of methanol and benzene, the mixed liquid of methanol and toluene, chloroform, etc., are used as a solvent for the adhesives. A mold for molding is preheated at 100 deg.C or higher. Accordingly, a copper foil circuit is shaped onto the surface of a molded form at the same time as the molding of the molded form while the molded form having excellent adhesion between the copper foil and the molded form can be acquired.</p> |
