| 摘要 |
<p>PURPOSE:To achieve higher production yields with a reduction in the generation of a damage to a cantilever beam, by a method wherein a weight section having a hole at the tip of the cantilever beam is formed by etching a semiconductor substrate and a weight is fixed in the hole after a stopper is locked. CONSTITUTION:A mask 7 is formed on the surface and back of an Si substrate 1 and the portion of the surface and back of the Si substrate 1 excluding the masks to form a weight section 4 having a hole 3 at the tip of a cantilever beam 2 with one end thereof supported. A stopper 12 is locked on the side of the Si substrate 1 to regulate at least one displacement of the weight section 4 and then, a spherical weight 6 is mounted into the hole 3.</p> |
