| 摘要 |
PURPOSE:To restrain the increase of chip area to a minimum, by setting the length of a first layer wiring having, on both ends, contact holes for connection with a second layer wiring, to a length necessary and sufficient to make two lines of the second layer wiring pass, and arranging said first layer wiring regularly on a master slice. CONSTITUTION:The first layer wiring 7, 11, 13 is provided, on both ends, with contact holes 9a, 9b, 15a-15d for connection with second layer wirings 6, 8, 10, 12, 14. The length of the first layer wiring is set to length necessary and sufficient to make pass two lines of second layer wiring 6, 8, 12, 14 which are kept, by an insulating film, electrically independent of the first layer wiring 7, 11, 13. Thus the first layer wiring segments of defined shape are constituted, which are regularly arranged on a master slice. Thereby shortening the time required for custom process after master slice process, and restraining the increase of chip area necessary for wiring. |
