| 摘要 |
PURPOSE:To prevent a semiconductor chip from warping together with a die pad for avoiding any cracking or deterioration in electrical properties by a method wherein the side edge of the die pad is bent upward to form a rib. CONSTITUTION:The sectional quadratic moment of a die pad part 1 is increased to add the strength to the bend by forming a rib 11 on the side of the die pad part 1. Besides, when a semiconductor chip 3 is diebonded, any warp etc., due to the difference in the coefficient of linear expansion can be minimized by forming the rib 11. Furthermore, the chip 3 shall not necessarily make a right angle with the angle of the rib 11. |
