Ceramic structure with copper based conductors and method for forming such a structure.

摘要

The ceramic composite structure has copper based conductors being resistant to oxidation and their resistivity is maintained to a value less than about three times the resistivity of pure copper and their melting temperature is maintained to a value greater than the sintering temperature of the ceramic, with the dielectric constant of the ceramic having a value less than about 10. The conductors are composed principally of copper and additives. The method comprises: forming at least one green sheet comprised of a thermoplastic organic binder having dispersed therein particles in particular of glass, said green sheet having a sintering temperature below the melting point of said copper based conductors; forming on a surface of said first green sheet a pattern of oxidation resistant copper based conductor forming composition; superimposing a second said sheet on said surface of said first sheet; laminating said superimposed sheets together; heating said laminate in air to a burn-out temperature; and sintering said laminate in a reducing or inert atmosphere.