| 摘要 |
A thermal print head comprises A) a heat sink substrate having a flat surface with corners extending along both sides; B) a heat resisting organic resin film supported on the flat surface of the substrate and folded at the corners; C) resistive heating layers comprising multiple resistive heating elements mounted on an area of the film on the flat surface, so the resistive layers are flat and unbent; D) metal circuit layers mounted on the substrate and connected to the heating layers; and E) an ic mounted on the substrate electrically connected to the circuit layers.
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