发明名称 |
Packaging For High Power Integrated Circuits Using Supercritical Fluid |
摘要 |
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure. |
申请公布号 |
US2008093732(A1) |
申请公布日期 |
2008.04.24 |
申请号 |
US20050720383 |
申请日期 |
2005.11.30 |
申请人 |
|
发明人 |
WILKINS WENDY L.;GILBERT BARRY K.;KLINE BRUCE R. |
分类号 |
H01L23/46 |
主分类号 |
H01L23/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|