| 摘要 |
<p>The apparatus circulates cooling fluid through a plurality of cooling modules (11) for cooling electronic components (33), such as IC or LSI. A plurality of cooling fluid supply systems are independently connected to the respective cooling modules (11), and each of the supply systems includes a fluid line (7a, 7b, ...) connected to a single tank (2) containing cooling fluid and provided with a pump (3) and a heat exchanger (5), so that the cooling fluid in the tank is circulated through the respective cooling modules (11) and returned to the tank (2), in which the cooling fluid is then mixed.</p> |
