| 摘要 |
<p>PURPOSE:To enable scribing the center of a scribe line, by arranging a groove having an arbitrary width at the center of each scribe line, along said scribe line to cut out chips from a semiconductor substrate, which groove serves as a mark. CONSTITUTION:At the time of scribing to cut off semiconductor chips 1 from a semiconductor substrate 4, grooves 3 for mark are arranged at the center of each scribe line 2 having a width of, e.g., several tens of mum. The scale center of a scribing equipment and the central part of the scribe line 2 can be easily made to coincide with each other by visual observation. Otherwise, discontinuous grooves or the like can be arranged in the central part of the scribe line 2, along the scribe line 2. Thereby alignment between the scale center of the scribing equipment and the scribe line is facilitated, and the working efficiency is improved.</p> |
