发明名称 |
Alignment marks on semiconductor wafers and method of manufacturing the marks |
摘要 |
Alignment marks on a semiconductor wafer comprise a first alignment island projecting from a surface of the wafer and a second alignment island having substantially the same height as the first alignment island and surrounding the same with a slit therebetween. The slit is utilized as a pattern for aligning with an alignment mark on a photomask. Preferably the alignment marks are formed on the grid line region of the wafer.
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申请公布号 |
US4824254(A) |
申请公布日期 |
1989.04.25 |
申请号 |
US19840612023 |
申请日期 |
1984.05.18 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
OHTSUKA, HIROSHI;ITOH, YOSHIO;NISHIMURO, TADASHI;MITSUTOMI, HISAMITSU |
分类号 |
G03F9/00;H01L21/027;H01L21/30;H01L23/544;(IPC1-7):G01B11/00 |
主分类号 |
G03F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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