发明名称 SEALING AND RETAINING BUSHING FOR INJECTION MOLDING
摘要 <p>This invention relates to sealing and support bushings which are located between the manifold and the mold back plate to encircle each valve pin in a multi-cavity valve gated injection molding system. Each bushing is bolted through the manifold to a respective heated nozzle with central bores in alignment to receive the valve pin ltherethrough. The bushing has an outer flanged portion which extends to contact the mold back plate and forms a leakage containment chamber between them. Thus, the bushings retain the manifold in place, seal against substantial melt leakage around the reciprocating valve pins and collect any melt which does escape to prevent it entering the insulative air space between the hot manifold and the cooled mold back plate. Location of the bushing between the manifold and the mold back plate also enables the use of a standard manifold having longitudinal and transverse bores without requiring diagonal bores.</p>
申请公布号 CA1252969(A) 申请公布日期 1989.04.25
申请号 CA19860520519 申请日期 1986.10.15
申请人 MOLD-MASTERS LIMITED 发明人 ROZEMA, HENRY J.;SCHMIDT, HARALD H.
分类号 B29C45/28;(IPC1-7):B29C45/20 主分类号 B29C45/28
代理机构 代理人
主权项
地址
您可能感兴趣的专利