| 摘要 |
<p>PURPOSE:To mount suitable chip component irrespective of the performance of extensibility at the time of dropping liquidlike sealing resin by arranging a dropping resin flow preventing frame around the sealing position of the compo nent, and then sealing the component by a dropping method. CONSTITUTION:After a film preventing frame 21 of dropping resin is provided on the periphery of the sealing position of a chip component 3, the component 3 is mounted by sealing by a dropping method. Since the frame 21 is disposed on the periphery of a mounting position when the component 3 is mounted by a sealing type between terminals 2a and 2b of the circuit 2 of a substrate 1, even if dropping liquidlike sealing resin 4 flows out, it is prevented by the frame 21 from flowing outside. Accordingly, it can prevent the dropping liquidlike sealing resin from flowing out during the mounting work of the compo nent 3 to eliminate the adverse influence to the function of the circuit 2 and other section, the decrease in the quality with loss of its external appearance. Thus, the accuracy and the quality of a printed wiring board can be improved.</p> |
