| 摘要 |
PURPOSE:To use a conventional wire bonding device and to provide many external connection signal pads without increasing the size of a semiconductor chip by composing bonding pads in a zigzag array. CONSTITUTION:Two rows of bonding pads 2a-2g of hexagonal or trapezoidal shape are arranged in two rows on a semiconductor chip 1. For example, the shape of the pad 2a has a square shape having 100mum of one side in such a manner that the central point is disposed at the vertexes of the zigzag line and one side is disposed to form 45 deg. with respect to one side of the chip. Thus, a conventional wire bonding device can be used, and many external connection signal pads, i.e., bonding pads can be provided without increasing in size the chip. |
