BONDING METHOD FOR SILICON SUBSTRATE,申请号JP19870262429-传众专利搜索

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发明名称	BONDING METHOD FOR SILICON SUBSTRATE
摘要
申请公布号	JPH01105526(A)	申请公布日期	1989.04.24
申请号	JP19870262429	申请日期	1987.10.16
申请人	FUJITSU LTD	发明人	YANAGIHARA FUMIO
分类号	H01L21/20	主分类号	H01L21/20
代理机构		代理人
主权项
地址

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