发明名称 STRUCTURE OF MEMORY CARD
摘要 PURPOSE: To improve the mechanical and thermal strength by using at least a piece of metallic plate for a plastic plate, inserting an electronic circuit between the insulating plates, and further the same are inserted between the metallic plates to form a sandwich structure. CONSTITUTION: An electronic circuit is formed by an electronic circuit substrate 3, a pattern 4 of the substrate and the electronic parts 5. The electronic parts 5 are mounted by using the surface mount technology SMT, and the very thin parts are used. An electronic circuit is inserted between the insulating plates 2, and further inserted between the metallic plates 1 to form a sandwich structure. By using the metallic plates as the facing of the memory card, the generation of bowing and cracking can be prevented, and the failure in the connection with an external equipment, the tearing of the pattern of the internal printed substrate, and the rupture of the electronic parts can be reduced.
申请公布号 JPH01105795(A) 申请公布日期 1989.04.24
申请号 JP19870264555 申请日期 1987.10.20
申请人 SEIKO EPSON CORP 发明人 SONOKAWA KIYOSHI
分类号 G06K19/077;B42D15/02;B42D15/10;G06K19/00 主分类号 G06K19/077
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