| 摘要 |
<p>PURPOSE:To remove a platelike body by a maximum removing margin by forming the ends of parallel grooves in a wedge state, and obliquely driving the body of a lower ahead state to a horizontal state even if one end of the body is engaged with the wedge. CONSTITUTION:When a wafer 5 is disposed in a carrier and one end of the wafer 5 is engaged with the wedge shape of the end 31b of the carrier, one end of the wafer 5 is raised in contact with the oblique face of the wedge shape, and one end of the opening end is brought into contact with the flat part of the groove 31, and hence contained in a lower ahead state. The carrier is raised at a lower ahead angle theta by an oblique driving mechanism. As a result, the removing margin (x) of the wafer 5 when the wafer 5 is disposed in the horizontal state coincident with the horizontal level L as compared with the margin (y) of the lower ahead state of the wafer 5, thereby extremely easily removing the wafer 5.</p> |
