| 摘要 |
PURPOSE:To contrive to prevent foreign matters from accumulating by a method wherein the cleaning of the space on a lower platen can easily done by mounting a cleaner to an upper platen. CONSTITUTION:After a semiconductor assembly, the molding of which is completed, is removed from a mold, a cleaner main body 11b is shifted toward an upper and a lower molds 3 and 5 by means of a cylinder 11c so as to bring the brushes 11d and 11d of cleaner units 11f and 11f into contact with both the mold surfaces in order to remove foreign matters on the mold surfaces. Since a clearer 11 is mounted to an upper platen 7, the space on a lower platen 2 is open, resulting in facilitating the cleaning of the space on the lower platen and preventing foreign matters from accumulating to a part of the lower platen. |
