| 摘要 |
<p>PURPOSE:To obtain chip electronic parts with improved operation reliability and easy modification and correction by performing degradation with irradiation of ultraviolet rays, dissolution with a specific organic solvent, and using a pellet-type tentative locking material with adhesiveness on both sides. CONSTITUTION:After mounting a pellet-type tentative locking material 16 be tween a pair electrodes 9 and 10, a chip capacitor 11 and a transistor 12 are mounted so that leading electrodes 11a and 11b and terminals 12a, 12b, and 12c are in contact with the electrodes 8, 9, and 10, respectively. Then, heating to a specified curing temperature, the pellet-type tentative locking materials 15 and 16 are cured and tentatively locked. In this case, if one part of the pellet-type tentative locking materials 15 and 16 projects from the electronic parts, ultraviolet rays are irradiated to allow the projecting part to be degradated and removed. Then, it is connected by a solder 13 electrically and mechanically. Thus, since a simple correction as well as a secure tentative locking can be made, mounting accuracy is improved to obtain a highly- integrated miniature electronic circuitry.</p> |
